We have designed and built an ultra-high vacuum chamber which allows thin film deposition on large area (up to 100 mm diameter) flat substrates and on three-dimensional substrates (e.g. 100 mm long, 50 mm diameter cylinders) by the pulsed laser deposition and reactive pulsed laser deposition techniques. Heating of substrates during and after film deposition is possible using either resistive heaters or a lamp array. Metal (Cu) and metal nitride (TiN) and carbide (TiC) films were deposited on Si wafers (60 and 100 mm diameter), three-dimensional steel substrates (steel cylinders and screws), Teflon plates, and paper sheets.
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