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EnglishIon implantation is a process in which ions are accelerated toward a substrate at energies high enough to bury them just below the surface substrate in order to modify the surface characteristics. Laser-produced plasma is a very suitable and low cost technique in the production of ion sources. In this work a laser ion source is developed by a UV pulsed laser of about 108 W/cm2 power density, employing a C target and a post ion acceleration of 40 kV to increase the ion energy. In this work, we implanted C ions on ultra-high-molecular-weight-polyethylene (UHMWPE) and low-density polyethylene (LDPE). We present the preliminary results of surface property modifications for both used samples. In particular, we have studied the modifications of the surface micro-hardness of the polymers by applying the “scratch test” method as well as the hydrophilicity modifications by the contact angle measurements.
| Titolo: | Polymer processing by a low energy ion accelerator | |
| Autori: | ||
| Data di pubblicazione: | 2008 | |
| Rivista: | ||
| Abstract: | Ion implantation is a process in which ions are accelerated toward a substrate at energies high enough to bury them just below the surface substrate in order to modify the surface characteristics. Laser-produced plasma is a very suitable and low cost technique in the production of ion sources. In this work a laser ion source is developed by a UV pulsed laser of about 108 W/cm2 power density, employing a C target and a post ion acceleration of 40 kV to increase the ion energy. In this work, we implanted C ions on ultra-high-molecular-weight-polyethylene (UHMWPE) and low-density polyethylene (LDPE). We present the preliminary results of surface property modifications for both used samples. In particular, we have studied the modifications of the surface micro-hardness of the polymers by applying the “scratch test” method as well as the hydrophilicity modifications by the contact angle measurements. | |
| Handle: | http://hdl.handle.net/11587/109513 | |
| Appare nelle tipologie: | Articolo pubblicato su Rivista |
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