The prediction of the interfacial failure mechanisms for adhesively bonded joints and composite structures is a well-known issue that has been studied both theoretically and/or numerically [1,2]. Small loads usually leave an adhesive junction bonded, where a jump of displacements is allowed due to the compliance of the interface. An increasing load, instead, can lead to adhesive breaks in one or more interface points where a crack starts and propagates along the interface, up to the complete detachment of the adherends. This work focuses on the development of a new theoretical approach to determine the debonding onset and propagation along weak interfaces under different loading conditions. The interfacial problem is addressed by means of the cohesive crack modeling, assuming a linearelastic behavior for the adherends and concentrating all non-linearities at the interface. This means that interfaces are considered as an assemblage of two sublaminates partly bonded together by an elastic interface. Such interface can be modeled as a continuous distribution of elastic springs acting along the normal and/or tangential direction depending on the interfacial loading condition. This generalizes the idea suggested recently in [3] for a single mode-I debonding. The analytical predictions of crack advancement, length of the process zone, maximum load and load-deflection response, are compared to the numerical results as provided by a simple nodeto- segment contact formulation. This is here generalized to handle cohesive forces along the normal and tangential directions, as employed in [4]. The very good agreement between analytical and numerical results confirms the accuracy of the theoretical proposed formulation.

An innovative study of the debonding process for adhesively bonded interfaces under different loading conditions

Rossana Dimitri
;
Giorgio Zavarise
2017

Abstract

The prediction of the interfacial failure mechanisms for adhesively bonded joints and composite structures is a well-known issue that has been studied both theoretically and/or numerically [1,2]. Small loads usually leave an adhesive junction bonded, where a jump of displacements is allowed due to the compliance of the interface. An increasing load, instead, can lead to adhesive breaks in one or more interface points where a crack starts and propagates along the interface, up to the complete detachment of the adherends. This work focuses on the development of a new theoretical approach to determine the debonding onset and propagation along weak interfaces under different loading conditions. The interfacial problem is addressed by means of the cohesive crack modeling, assuming a linearelastic behavior for the adherends and concentrating all non-linearities at the interface. This means that interfaces are considered as an assemblage of two sublaminates partly bonded together by an elastic interface. Such interface can be modeled as a continuous distribution of elastic springs acting along the normal and/or tangential direction depending on the interfacial loading condition. This generalizes the idea suggested recently in [3] for a single mode-I debonding. The analytical predictions of crack advancement, length of the process zone, maximum load and load-deflection response, are compared to the numerical results as provided by a simple nodeto- segment contact formulation. This is here generalized to handle cohesive forces along the normal and tangential directions, as employed in [4]. The very good agreement between analytical and numerical results confirms the accuracy of the theoretical proposed formulation.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11587/418259
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